Epoxy Semi-Paste Adhesive, Bonds Plastic and Metal, Good for Composite Bonding

Cure temp: 77 ºF/ 25 ºC     Pot life: 75 min

Qualified to MMM-A-132, Rev A, Type 1, Class 3

Cure temp: 77 ºF/25 ºC     Pot life: 30 min

Bell peel: 15 lb/in, 70 N/25 mm     Service temp: 180 ºF/82 ºC

Bell peel: 75 lb/in, 335 N/25 mm     Service temp: 180 ºF/82 ºC

Bell peel: 60 lb/in, 265 N/25 mm     Service temp: 180 ºF/82 ºC

Bell peel: 60 lb/in, 265 N/25 mm     Service temp: >225 ºF/107 ºC

Bell peel: 60 lb/in, 265 N/25 mm     Service temp: 180 ºF/82 ºC

Density: .67 g/cc     Service temp: 160 ºF/71 ºC  

Service temp: >200 ºF/93 ºC     Pot life: 60 min

Service temp: 350 ºF/177 ºC     100 min

MMM-A-132 Rev A, Type I, Class 3

Service temp: 250 °F/121 °C       Pot life: 35 min

Service temp: 350 ºF/177 ºC     Pot life: 100 min

Service Temp: 350 °F/177 °C     Pot life: 90 min

Qualified to MMM-A-132 Rev A, Type I, Class 3

Non-Sag, Self-Extinguishing

Fast Set Adhesive, 1:1 Mix Ratio, Paste Consistency

Toughened, Performance to 350°F (177°C), Low Sag Paste

Quick Set Paste, Room Temperature Cure, 1:1 Mix Ratio

Quick Set Adhesive, Good Peel Strength, 1:1 Mix Ratio

Self Extinguishing Adhesives, Gap Filling Properties, Early Green Strength

Bonds Plastic and Metal, Good Composite Bonding

Long Work Life, High Strength Adhesive, Qualified to BMS 5-126

Room Temperature Cure, Non-Flow Paste, Long Work Life

High Temperature Adhesive, Low Outgassing, One Hour Work Life

Room Temperature or Heat Cure, Spray or Roller Application, Strippable

Room Temperature Cure, Good Electrical Properties, For Bonding and Filling

Flexible Epoxy Adhesive, Room Temperature Cure, Variable Mix Ratio

Room Temperature or Heat Cure, Brushable Viscosity, 100% Solids

Room Temperature Cure, Quick Set, Non-flow Paste

A low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength up to 350°F